Attachment Method: Hook & Loop
1" in thickness
Recommended Tools: Mini Polisher, Random Orbital DA
 
Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS Technology™ solves this common problem using strategic patterns of partially closed foam cells. Now available on our Heavy Duty Orbital (HDO) pads, giving the operator the added benefit of the durable, dual layer design and tapered edge.
Benefits:
Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
Dual Layer – The dual layer design reduces lateral/horizontal movement, resulting in a reduction of friction inside the pad which increases durability by eliminating excessive heat and reduces foam fatigue.